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Established in 1991, CHIPS, Inc. offers unparalleled quality, fast turnaround and competitive pricing in wafer thinning, sawing, bare die pick & place, bumped die, pick & place into tape

  Offering Unparalleled Wafer to Die Processing

Established in 1991, CHIPS, Inc. offers unparalleled quality, fast turnaround and competitive pricing in wafer thinning, wafer sawing, bare die pick & place, bumped die, pick & place into
tape and reel, SOT/SOIC place into tape, and visual inspection.

 

Introduction/Facilities • Wafer Sawing • Wafer Thinning • Bare Die Pick & Place
 Bare Die Tape & Reel • Probe Map Pick & Place • SOT/SOIC Tape & Reel • Visual Inspection
 RFQ Form • Contact • Employment Opportunities