Established in 1991,
CHIPS, Inc. offers unparalleled
quality, fast turnaround and competitive pricing in wafer thinning,
wafer sawing, bare die pick & place, bumped die, pick & place into tape
and reel, SOT/SOIC place into tape, and visual inspection.
CHIPS
Customers and Markets Include:
MCM
Hybrid
Semi-Conductor
Custom Package
Chip on Board
Smartcard
Wireless
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