Wafer Sawing & Cutting Capabilities

8" Saw

New 8" Saw - Click for larger viewCHIPSí can handle virtually all of your wafer sawing and cutting needs for silicon, bumped silicon, GaAs, SiGe, Glass, Quartz, and composite material wafers with sizes up to and including 8"/200mm.  CHIPS runs its saws on three shifts for fast turnaround. Single pass or progressive cutting can be used to perform either saw-through or custom sawing at various depths. Coolant/wash is supplied from our in-house de-ionized water system. All incoming wafers are inspected prior to processing. CHIPSí focus produces a quality level in cleanly cut, particle free wafers and die, unparalleled in the industry.